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A void closure model based on hydrostatic integration and the Lode parameter for additive manufacturing AlSi10Mg
Journal of Manufacturing Processes  (IF5.01),  Pub Date : 2021-11-23, DOI: 10.1016/j.jmapro.2021.10.056
Liqun Niu, Qi Zhang

The void closure model is urgently needed for the subsequent hot forming process of additive manufacturing (AM) products. The influence of temperature, Lode parameter, and hydrostatic integration (Gm) on void closure was studied by representative volume element (RVE) simulations. The results show that Gm and the Lode parameter significantly influence void closure, and the temperature effect is related to material properties. A new model accounting for Gm and Lode parameter in evaluating void closure was developed using linear regression with an average error of 2.1% in comparison to RVE simulations. X-ray computed tomography (CT) was carried out at different high reductions for the AM cylinder's hot forging experiments. The new and stress-triaxiality-based (STB) models were integrated into the ABAQUS and compared with the CT measurements. Results indicate that the model is more precise than the STB model, suggesting that the model can be appropriately applied to forecast void closure during the hot forging process for AM products.