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Using Sealants for Gluing Dissimilar Materials
Polymer Science, Series D  (IF),  Pub Date : 2021-02-25, DOI: 10.1134/s1995421221010202
A. P. Petrova, N. F. Lukina, A. K. Alekhin, Ya. A. Bryk


Data on gluing of various nonmetallic materials, as well as dissimilar materials with different TLEC values using Viksint U-2-28 and Viksint U-10-80 organosilicon sealants, as well as Elasil 137-175M organosilicon adhesive sealant, are given. It is shown that adhesive joints of dissimilar materials with different TLEC values could resist impact and pulse loads upon operation, while adhesive joints of nonmetallic materials operate under bending loads.