Find Paper, Faster
Example:10.1021/acsami.1c06204 or Chem. Rev., 2007, 107, 2411-2502
Plasma-Enhanced Chemical Vapor Deposition of Two-Dimensional Materials for Applications
Accounts of Chemical Research  (IF24.466),  Pub Date : 2021-02-03, DOI: 10.1021/acs.accounts.0c00757
Kongyang Yi, Donghua Liu, Xiaosong Chen, Jun Yang, Dapeng Wei, Yunqi Liu, Dacheng Wei

Since the rise of two-dimensional (2D) materials, synthetic methods including mechanical exfoliation, solution synthesis, and chemical vapor deposition (CVD) have been developed. Mechanical exfoliation prepares randomly shaped materials with small size. Solution synthesis introduces impurities that degrade the performances. CVD is the most successful one for low-cost scalable preparation. However, when it comes to practical applications, disadvantages such as high operating temperature (∼1000 °C), probable usage of metal catalysts, contamination, defects, and interstices introduced by postgrowth transfer are not negligible. These are the reasons why plasma-enhanced CVD (PECVD), a method that enables catalyst-free in situ preparation at low temperature, is imperatively desirable.